Application:fine chemical industry, pharmaceutical industry, environmental protection engineering
Dimension:the maximum diameter of tube bundle block can reach 200mm, and the height can be 500mm.
Material:Silicon carbide
Application:glass polishing compounds, precipitating and decoloring agents and also used in ceramic, catalysts and electronics industries.
CAS No.:1036-38-3
Material:CeO2
Application:integrated circuits , detector / sensor device , MEMS fabrication, opto-electronic components, and solar cells
Diameter:Ø 2" / Ø 3" / Ø 4" / Ø 6" / Ø 8" / Ø 12"
Oxide Thickness:100 A ~ 6 um
Application:integrated circuits , detector / sensor device , MEMS fabrication, opto-electronic components, and solar cells
Diameter:Ø 4"/ Ø 6" / Ø 8"
Device Thickness:2 um ~ 300 um
Application:Semiconductor device , Microelectronics , Sensor , Solar cell , IR optics.
Diameter:Ø 2" / Ø 3" / Ø 4"
Thickness:500 um ~ 625 um
Application:making LD , LED , microwave circuit and solar cell applications
Diameter:Ø 2" / Ø 3" / Ø 4"
Thickness:350 um ~ 625 um
Application:red , yellow , and green LED ( light-emitting diodes )
Diameter:Ø 2"
Thickness:400 um
Application:red , yellow , and green LED ( light-emitting diodes )
Diameter:Ø 2" / Ø 3"
Thickness:500 um ~ 625 um
Application:red , yellow , and green LED ( light-emitting diodes )
Diameter:Ø 2" / Ø 3"
Thickness:500 um ~ 625 um
Application:red , yellow , and green LED ( light-emitting diodes )
Diameter:Ø 2" / Ø 3"
Thickness:500 um ~ 625 um
Application:microelectronics , optoelectronics and RF Microwave
Diameter:Ø 3" / Ø 4" GaAs wafer
Thickness:500 um ~ 625 um
Application:microelectronics , optoelectronics and RF Microwave
Diameter:Ø 3" / Ø 4" GaAs wafer
Thickness:500 um ~ 625 um
